Thermal-hydraulic performance of MEMS-based pin fin heat sink

By Ali Kosar, Yoav Peles. 2006

229 citations recorded by the source corpus.

View Paper: https://www.semanticscholar.org/paper/8e831f52555e517b00cc342a5696e4417a94f364

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In Mechanical Engineering

Citations in the corpus

Three dimensional numerical analyses and optimization of offset strip-fin microchannel heat sinks (2009, background): “Advanced microchannel structures, such as two-layered parallel-microchannels [2], stacked microchannels [3], tree-shaped microchannel network [4], and stripfinmicrochannels [5,6] or micro-pin fin [7–10], have been proposed to lower the pressure drop and enhance temperature uniformity.”
History, Advances, and Challenges in Liquid Flow and Flow Boiling Heat Transfer in Microchannels: A Critical Review (2012, background): “Kosar and Peles [91] experimentally studied pin fins of circular crosssection extending over the entire height of microchannels.”
A Review On Transient Thermal Management of Electronic Devices (2021, background): “TDP is estimated as TDP ¼ Tj;max Tambient Rtot (1) where Tj,max, and Tambient are the maximum allowable junction temperature and ambient temperature, respectively, while Rtot is Table 1 List of conventionally employed thermal management techniques and their performance capabilities as reported in li”
Computational analysis of nanofluid effects on convective heat transfer enhancement of micro-pin-fin heat sinks (2012, methodology): “We have simulated only one symmetrical part of MPFHS used in the experimental work of Kosar and Peles [1] with the same boundary”
Flow boiling of water in a circular staggered micro-pin fin heat sink (2008, methodology): “experimental Nusselt number as a function of the Reynolds number is compared with the results obtained by Kosar and Peles [ 10 ], and is found to be in good agreement.”
Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal (2007, background): “2006, Kosar and Peles [45] Micro pin fins,”
Thermo-fluid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot (2015, background): “The reason for staggered arrangement of micro pin-fins was to enhance the convection heat transfer [16].”