Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

By Ravi Mahajan, R. Sankman, N. Patel, Dae-woo Kim, K. Aygun, Z. Qian, Y. Mekonnen, I. Salama, Sujit Sharan, D. Iyengar and 1 more. Electronic Components and Technology Conference, 2016

302 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/8be0f8858474cc143bead28d88d44be9ff8affac

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1. Jin-Hee Cho
2. Kwiwook Kim
3. Keith Kim
4. Kangseol Lee
5. H. Jin
6. Hongshin Jun
7. H.-Y Son

Citations in the corpus

• HBM (High Bandwidth Memory) DRAM Technology and Architecture (2017, methodology): “D TSV Integration”, Proceedings in ECTC (2013) [10] H. Liu, et al., ‘‘Effect of IMC Growth on thermal cycling reliability of micro solder bumps’’ Proceedings in EPTC (2013) [11] W.S. Kwon, et al., "Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnec”