Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication

By A. Carlson, Audrey M. Bowen, Yonggang Huang, Ralph G. Nuzzo, John A. Rogers. Advances in Materials, 2012

832 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/8b21d823eee88433d0aed9469778441150005e82

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Leandro Lorenzelli
2. Ravinder S. Dahiya
3. Saleem Khan
4. Zhenqiang Jack Ma
5. Guillermo Tostado-Blázquez
6. P. Nealey
7. Weidong Zhou
8. Derya Baran

In Electrical and Electronic Engineering

1. Ravinder S. Dahiya
2. Saleem Khan
3. Zhenqiang Jack Ma
4. Guillermo Tostado-Blázquez
5. Leandro Lorenzelli
6. David D. Awschalom
7. Weidong Zhou
8. Derya Baran

Citations in the corpus

• Flexible Electronics: Status, Challenges and Opportunities (2020, methodology): “The pattern transfer process uses a rigid donor substrate for the deposition of films through vacuum processes and then transfers it onto a soft target substrate through stamping (Carlson et al., 2012).”
• Transfer print techniques for heterogeneous integration of photonic components (2017, positive): “The protocols for efficient transfer of devices have been investigated for different situations on the receiving wafer and are reviewed in [21].”
• Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review (2015, methodology): “tures and surface related issues for the stamps are very critical to be controlled [40].”