Dense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface Materials

By Tao Tong, Yang Zhao, L. Delzeit, A. Kashani, M. Meyyappan, Arun Majumdar. IEEE transactions on components and packaging technologies, 2007

336 citations recorded by the source corpus.

Carbon nanotube (CNT) arrays are being considered as thermal interface materials (TIMs). Using a phase sensitive transient thermo-reflectance technique, we measure the thermal conductance of the two interfaces on each side of a vertically aligned CNT array as well as the CNT array itself. We show that the physically bonded interface by van der Waals adhesion has a conductance ~105W/m2K and is the dominant resistance. We also demonstrate that by bonding the free-end CNT tips to a target surface with the help of a thin layer of indium weld, the conductance can be increased to ~106W/m2K making it attractive as a TIM

Subfields: Civil and Structural Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/8a54476d3f19719f7bdd4a8937d832ef17bede2c

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Citations in the corpus

Recently emerging trends in thermal conductivity of polymer nanocomposites (2016, background): “Thus, for so many years, CNTs that are vertically aligned have been proposed for thermal interface applications (Tao et al. 2007).”
Present and future thermal interface materials for electronic devices (2018, background): “the substrate at the atomic or molecular scale, this thermal boundary resistance becomes the limiting thermal resistance [52,66,76,77], though other aspects including but not limited to the quality of the CNTs [64],”
Thermal conduction phenomena in carbon nanotubes and related nanostructured materials (2013, background): “The thermal diffusivity and thermal conductivity in aligned CNT arrays is highly anisotropic, such that the axial thermal conductivity is as much as 110 times greater than the radial conductivity (Borca-Tasciuc et al., 2005; Ivanov et al., 2006; Tong et al., 2006, 2007; Son et al., 2008).”
Novel nanostructured thermal interface materials: a review (2018, methodology): “5 [154] Si–CNT–In–Glass Indium 100–1000 20–30 – 10 ∼1 [128] Si–CNT–Ag + Pd Pd Thiolate 100–1000 ∼30 0.”
Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects (2009, methodology): “using CNT as thermal interface materials (TIMs) for packaging [148], [149] and have demonstrated that CNTs can provide lower thermal resistance.”
Contact mechanics and thermal conductance of carbon nanotube array interfaces (2009, methodology): “[21] used an alloptical pump and probe phase sensitive transient thermo-reflectance method to measure a thermal resistance value of 12 mm(2) K/W for a Si–CNT–glass interface, which is very close to the result presented in [15].”