Reliability of power cycling for IGBT power semiconductor modules
By A. Morozumi, K. Yamada, T. Miyasaka, Y. Seki. Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248), 2001
272 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/89c0104426116b42f6ab24385a90dd4263677c1c
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In Electrical and Electronic Engineering
Citations in the corpus
- Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review (2015, background): “TABLE I COMPARISON BETWEEN WIRE-BOND AND PRESS-PACK MODULES [28], [30], [90], [91]”