Thermal stability of arc evaporated high aluminum-content Ti1−xAlxN thin films

By A. Hörling, L. Hultman, M. Odén, J. Sjoelen, L. Karlsson. 2002

344 citations recorded by the source corpus.

Subfields: Condensed Matter Physics, Electrical and Electronic Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/872acf6d0c3aefd076231d0c60e1ce7749ea634e

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. P. Mayrhofer
2. C. Mitterer
3. H. Clemens
4. L. Hultman
5. G. Greczynski

In Mechanics of Materials

1. P. Mayrhofer
2. H. Clemens
3. C. Mitterer
4. L. Hultman
5. J. Musil
6. A. Anders

Citations in the corpus

• Microstructural design of hard coatings (2006, methodology): “66N were deposited onto cemented carbide substrates in a high-vacuum arc-evaporation system and subjected to furnace annealing [58].”