A liquid metal cooling system for the thermal management of high power LEDs
By Yueguang Deng, Jing Liu. 2010
177 citations recorded by the source corpus.
Subfields: Civil and Structural Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/847c912ac9b18529cc20529473c4a24af1e96bd3
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Mechanical Engineering
Citations in the corpus
- Micro-Encapsulated Phase Change Materials: A Review of Encapsulation, Safety and Thermal Characteristics (2016, background): “These PCMs are currently studied for the cooling of electronic equipment [118,119], high power LEDs [120], heat exchangers [120] and for exergy from low-grade heat energy to produce electricity [121,122].”
- Thermal and electrical conductivity of binary magnesium alloys (2014, background): “In the area of electronic manufacturing, along with the fast improvement of the semiconductor’s performance, pursuits of the high integrated structure, high operation frequency, and speed become the dominant trend [3].”
- Heat and fluid flow in high-power LED packaging and applications (2016, background): “Liu [283] proposed to use liquid metal as the coolant rather than water to cool high power LEDs.”