A printable form of silicon for high performance thin film transistors on plastic substrates

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Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review (2015, background): “5 cm for polymer substrate, which is still sufficient for many devices and applications [37], [107], [108].”
Transfer print techniques for heterogeneous integration of photonic components (2017, positive): “A major advance was made by the Rogers group at University of Illinois who introduced a technique where coupons of material could be transferred in a controllable, massively parallel manner with micron scale accuracy from a source wafer to a separate target substrate [18,19].”
High-speed mechanically flexible single-crystal silicon thin-film transistors on plastic substrates (2006, methodology): “Some recent research that is designed to address this issue, while retaining the attractive processing attributes of the organics, explores the use of unusual structural forms—micro/nanowires, platelets, ribbons, etc.—of high quality single-crystal inorganic semiconductors [2]–[6].”
High-resolution electrohydrodynamic jet printing. (2007, neutral): “and single-crystal Si rods (length: 50 μm, width: 2 μm, thickness: 3 μm”