Hot embossing as a method for the fabrication of polymer high aspect ratio structures

By H. Becker, U. Heim. 2000

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Review of polymer MEMS micromachining (2015, background): “PMMA, PC, and PS are thermoplastic polymers typically used for microfluidic applications, and have found success with hot embossing techniques to form devices largely due to their mechanical strength with relatively low glass transition temperature (Tg), low-cost, and biocompatibility [5].”
Injection molding of polymer micro- and sub-micron structures with high-aspect ratios (2006, background): “The economical fabrication of high quality polymer micro- and sub-microstructures is a challenge that must be met as micro- and submicron structured components become more widely used [3, 4].”
Rapid prototyping of microfluidic chips in COC (2007, methodology): “This trend to use polymer chips in microfluidics is driven by costefficient replication techniques such as hot embossing [1–4, 8] or injection molding [5–10] as well as the huge variety and the favorable pricing of polymers [11].”
Direct-write laser micromachining and universal surface modification of PMMA for device development (2004, methodology): “Several fabrication methods such as hot embossing [1], wire imprinting[2], and excimer”