Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

By A. Schubert, R. Dudek, E. Auerswald, A. Gollbardt, B. Michel, H. Reichl. 53rd Electronic Components and Technology Conference, 2003. Proceedings., 2003

407 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/745df54705fc43133272037925ef6b8318695935

Citations in the corpus

• Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints (2004, unknown): “Recently, a number of papers have been published [6, 7, 8, 9] on the constitutive equation for creep deformation for SnAgCu alloy for compositions currently in considerations.”