Micro and miniature heat pipes – Electronic component coolers

By L. Vasiliev. 2008

230 citations recorded by the source corpus.

How researchers see this paper

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Start-up, heat transfer and flow characteristics of silicon-based micro pulsating heat pipes (2012, background): “Various efforts have been made in the past decades to develop novel technologies capable of removing larger amount of heat from chips, among which micro heat pipes are considered as one of the most promising options [5].”
Experimental investigation of titanium nanofluids on the heat pipe thermal efficiency (2008, methodology): “Vasiliev [6,7] applied the micro and miniature heat pipes in modern heat exchangers for cooling electronic components.”
A review of small heat pipes for electronics (2016, methodology): “To achieve a higher heat transfer coefficient and heat transfer surface area per unit flow volume, MLHP and MCPL were created with smaller hydraulic diameters [13]; the “micro” typically indicates micro wicks.”
Recent Advances in Heat Transfer Enhancements: A Review Report (2010, background): “Vasiliev [144] has reviewed and listed the heat pipe R&D work on conventional heat pipes, heat pipe panels, loop heat pipes, vapor-dynamic thermosyphons, micro/miniature heat pipes, and sorption heat pipes in different industrial applications.”
Loop heat pipe for cooling of high-power electronic components (2009, background): “As for heat pipe-based heat exchangers, they present greater overall efficiency as well as a low mass of working fluid [1,2].”