Loop heat pipe for cooling of high-power electronic components

By L. Vasiliev, David Lossouarn, C. Romestant, A. Alexandre, Y. Bertin, Y. Piatsiushyk, V. Romanenkov. 2009

151 citations recorded by the source corpus.

Subfields: Computational Mechanics, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/48ddb0372be4a0a99689ca2c3f737c8f2da7c187

How researchers see this paper

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In Mechanical Engineering

1. S. Zeinali Heris
2. M. Kahani

Citations in the corpus

• HEAT TRANSFER ENHANCEMENT USING AL2O3/WATER NANOFLUID IN A TWO-PHASE CLOSED THERMOSYPHON (2009, background): “TPCTs have simple structure, small thermal resistance, high efficiency and low fabrication cost making them one of the most widely used devices in many fields, such as heat recovery, electronics and solar heating systems (Noie et al., 1999; Akbarzadeh et al., 1997; Xiau et al., 1996; Liu et al., 199”