Numerical study on the measurement of thin film mechanical properties by means of nanoindentation

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On the uniqueness of measuring elastoplastic properties from indentation: The indistinguishable mystical materials (2007, methodology): “Various techniques have been proposed to subtract off the substrate effect from indentation analysis in order to measure the intrinsic film properties (Chen and Vlassak, 2001; Saha and Nix, 2002; Cheng and Cheng, 2004).”
Plane-strain Bulge Test for Thin Films (2005, background): “For example, nanoindentation is often affected by the presence of the substrate, and it is not suitable for measuring the work-hardening behavior or the residual stress in the film.(8,9) In the substrate curvature technique, the film strain can only be changed by changing the temperature, thus makin”
Nanoscale Mechanical Characterization of Polymers by AFM Nanoindentations: Critical Approach to the Elastic Characterization (2006, background): “The so-called 10% rule for the ratio of indentation depth and film thickness is therefore certainly satisfied [35], and even accounts for criticalities recently pointed out by numerical simulations [36, 37].”