Interfaces and stresses in thin films

By F. Spaepen. 2000

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Stretchable Interconnects for Elastic Electronic Surfaces (2005, background): “In contrast, the discovery of electrical continuity in flattened then over-stretched flat films was a surprise, because flat free-standing metal films can be stretched by only 1%–2% before they rupture [4].”
Eshelby formalism for nano-inhomogeneities (2005, background): “…April 2005 epted 23 May 2005 3335 q 2005 The Royal Society of researchers in physics, materials science and mechanics for many years (e.g. Thomson et al. 1986; Streitz et al. 1994; Gurtin et al. 1998; Nix & Gao 1998; Wu et al. 1998; Spaepen 2000; Kong & Wang 2003; Sharma et al. 2003, among others).”
Thin Film Materials: Stress, Defect Formation and Surface Evolution (2004, background): “How does this load transfer occur? Is it possible that there is slippage between the crystallite and the substrate in the course of island growth, perhaps in the form of glide, so that the load is only partially transferred and more relaxation of surface stress induced mismatch occurs than is usuall”