Interlayer cooling potential in vertically integrated packages

By T. Brunschwiler, Bruno Michel, H. Rothuizen, U. Kloter, B. Wunderle, H. Oppermann, H. Reichl. 2008

183 citations recorded by the source corpus.

Subfields: Computational Mechanics, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/8207a20d7804fe5f4b3a9daca94e4c38d576fc1e

Citations in the corpus

• Co-designing electronics with microfluidics for more sustainable cooling (2020, unknown): “The cooling approaches were classified as SPMC ([19], [61]), Pin-fins 149 ([61], [62]), Strip-fins ([61], [63], [64]), MMC ([29], [65]–[68][69]), Impinging jet ([37], [61], [70]– 150 [72]), and mMMC (This work).”