Modeling and analysis of manufacturing variations
By S. Nassif. Proceedings of the IEEE Custom Integrated Circuits Conference, 2001
450 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Hardware and Architecture
View Paper: https://www.semanticscholar.org/paper/5cf384c11d250bfbaef61323f637ad867eafcce6
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In Electrical and Electronic Engineering
In Hardware and Architecture
Citations in the corpus
- Modeling of failure probability and statistical design of SRAM array for yield enhancement in nanoscaled CMOS (2005, background): “scaling [1]–[5], analysis and reduction of the mismatch-induced parametric failures in an SRAM cell is extremely necessary to enhance the yield of a memory designed in nanoscaled complementary metal–oxide–semiconductor (CMOS) [8], [9].”
- Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods (2006, background): “This is due to the rising impact of global and random sources of variations on performance characteristics of VLSI circuits [57], which tend to increase the criticality of temperature dependencies in the circuit.”