Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys
By A. Telang, T. Bieler, J. P. Lucas, K. N. Subramanian, L. Lehman, Y. Xing, E. Cotts. 2004
140 citations recorded by the source corpus.
Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/5a50f41412688c98835d60410e05a86e37cf6548
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In Aerospace Engineering
In Electrical and Electronic Engineering
In Mechanical Engineering
Citations in the corpus
- Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints (2008, background): “comprised of a few very large Sn grains [4]–[6].”