Advanced electronic packaging

By W. Brown, R. Ulrich. 2006

198 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/59cf0afaed20a3c0fc9c91d9d68b73c0102b246a

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In Electrical and Electronic Engineering

1. Dushan Boroyevich

Citations in the corpus

• Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules (2007, background): “In particular, the integration of high temperature power devices and high temperature control electronics into a single module minimizes parasitics, allowing very high frequencies of operation [1][48] and making feasible the manufacture of converter systems with high power density [49].”