Direct Ink‐Jet Printing of Ag–Cu Nanoparticle and Ag‐Precursor Based Electrodes for OFET Applications
By S. Gamerith, A. Klug, Horst Scheiber, Ullrich Scherf, E. Moderegger, E. List. 2007
301 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/5403ea56b9dcaf31d0723a05555541813a14464c
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Biomedical Engineering
- Francesco Bonaccorso
- Zhipei Sun
- Tawfique Hasan
- Marc P. Y. Desmulliez
- Gerard Cummins
- Andrea C. Ferrari
- F. Torrisi
- J. Steinke
In Electrical and Electronic Engineering
- Tawfique Hasan
- F. Torrisi
- Zhipei Sun
- Andrea C. Ferrari
- Francesco Bonaccorso
- J. Steinke
- Shlomo Magdassi
- A. Kamyshny
Citations in the corpus
- Inkjet-printed graphene electronics. (2011, background): “In fact, the presence of silane groups in the molecular structure of HMDS(91) acts as promoter of metallic particle adhesion to the substrate.(91,127) Analogously, HMDS may promote the adhesion of graphene flakes to the substrate, thus favoring the formation of a regular network.”
- Metal-based Inkjet Inks for Printed Electronics (2011, background): “Typical solvents for Ag-based inkjet inks described so far are water [118, 152, commercial Metalon JS-011 and JS-015 inks of Novacentrix]; alcohols and other oxygenated solvents [12, 13, 144, 153, commercial Ag 50P ink of Samsung ElectroMechanics, IJ 242-54 ink of Cima NanoTech, and CKR ink of Sumim”
- Inkjet printing of conductive materials: a review (2012, background): “These polymers typically have lower conductivities than metallic inks (Gamerith et al., 2007), and may require the use of inert atmospheres due to their high susceptibility to ambient humidity and their reactivity with oxygen.”