A review of mechanical properties of lead-free solders for electronic packaging

By Hongtao Ma, J. Suhling. Journal of Materials Science, 2009

580 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/52ae316d3e51dfa34e8942fcd48d903480be15c9

Citations in the corpus

• Determination of Anand constants for SAC solders using stress-strain or creep data (2012, unknown): “[1].”