Power Cycling Reliability of Power Module: A Survey

By C. Durand, M. Klingler, D. Coutellier, H. Naceur. IEEE transactions on device and materials reliability, 2016

212 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/49474ff214fce7e747bd13fa3b9af688d0fc81e4

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Huai Wang
2. Frede Blaabjerg
3. U. Choi
4. Søren Jørgensen
5. Xiongfei Wang
6. Marco Liserre
7. Ke Ma
8. Friedrich Wilhelm Fuchs

In Mechanical Engineering

1. Frede Blaabjerg
2. U. Choi
3. Søren Jørgensen
4. Huai Wang

Citations in the corpus

• Power Electronics Reliability: State of the Art and Outlook (2021, methodology): “Nevertheless, it is reported that 86% of the power cycling tests have only one sample per test run based on the 70 publications discussed in [4].”
• Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress (2018, methodology): “Typically, in the PC test, high Tj (40 °C∼100 °C) and Tjm (60 °C∼120 °C) are applied to the DUT in order to obtain test results in a reasonable test time [16], [31].”
• A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues (2020, background): “conventional power module package are wire bond lift-off, cracking or delamination of solder die (or substrate) attach, and chip metallization on the top side [37], [38].”