The Science and Engineering of Microelectronic Fabrication
By S. Campbell. 2001
766 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/48f69f69521ba30d03b4b1edd9b9f73be3c69abe
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In Electrical and Electronic Engineering
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Citations in the corpus
- Hard and soft micromachining for BioMEMS: review of techniques and examples of applications in microfluidics and drug delivery. (2004, methodology): “Most MEMS fabrication techniques have their roots in the standard manufacturing methods developed for the semiconductor industry [10–12].”
- Studies on surface wettability of poly(dimethyl) siloxane (PDMS) and glass under oxygen-plasma treatment and correlation with bond strength (2005, background): “With an increase in pressure, the sheath of charged particles formed near the electrode move closer to the substrate [3].”
- Flexible electronics under strain: a review of mechanical characterization and durability enhancement strategies (2016, background): “Evaporation, sputtering and CVD have long been R2R compatible [144–148], although the high temperatures generally associated with CVD reactions make development of processing conditions compatible with plastic substrates more challenging than in analogous processes on rigid substrates.”
- Nanomaterials for Neural Interfaces (2009, unknown): “[457] S.”
- Opportunities for mesoscopics in thermometry and refrigeration: Physics and applications (2005, methodology): “. E. Lithography and etching techniques Fabricationofthin filmmetallic circuitsaswellassemiconductor micro- and nanodevices requires the generation of suitable patterns through lithographic processes (Campbell, 2001; Jaeger, 2002; Plummer et al., 2000). Lithography, indeed, is the method used to tran”
- Fabrication of Micrometer‐Scale, Patterned Polyhedra by Self‐Assembly (2002, background): “, ion implantation) used to build silicon-based microdevices([9]) are inherently planar techniques.”