Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
By L. Lehman, S. Athavale, T. Z. Fullem, A. Giamis, R. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Rae, J. Wang and 4 more. 2004
169 citations recorded by the source corpus.
Subfields: Aerospace Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/45441cd0627a50781b292f4d477e91afd2e58146
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In Aerospace Engineering
In Electrical and Electronic Engineering
Citations in the corpus
- Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints (2008, background): “This microstructure is a result of a solidification phenomenon also known as cyclic twinning [4].”