Reliability assessment of sintered nano-silver die attachment for power semiconductors

By M. Knoerr, S. Kraft, A. Schletz. Electronic Packaging Technology Conference, 2010

161 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/38e8b8b030ff8a66dce9626be5fb7bb34fadea75

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. D. Henry
2. Laurent Mendizabal

Citations in the corpus

• Survey of High-Temperature Reliability of Power Electronics Packaging Components (2015, background): “regulations of the restriction of hazardous substances (RoHS) [7], [8].”