Material challenge for flexible organic devices

By John Lewis. 2006

589 citations recorded by the source corpus.

Outside of the active device layers, there are a variety of requisite functional layers in flexible organic electronic devices. Whether the application is in displays, lighting, integrated circuits, or photovoltaics, there are materials challenges in implementing flexible and/or organic devices into practical applications. We highlight two topics that are common to most flexible electronic technologies. First, we describe the difficulty in developing suitable permeation barriers on polymer substrates, the approaches being taken to solve this problem, and their current status. Second, we highlight the limited mechanical ruggedness of brittle inorganic films and present approaches for improving overall device flexibility.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/344ad4297a96688a14bd69f0830757d8a1f039f5

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In Biomedical Engineering

In Electrical and Electronic Engineering

Citations in the corpus

A Review of Flexible OLEDs Toward Highly Durable Unusual Displays (2017, background): “, water vapor transmission rate (WVTR) <10−6 g/m2/day] [57].”
Device stability of perovskite solar cells – A review (2017, methodology): “Similar encapsulation methods used in OPV involving attachment of the glass or metal to the device using a slow permeation adhesive material [195], [196] are suitable for encapsulating rigid PSCs application.”
Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review (2015, unknown): “COMPARISON OF POLYMER SUBSTRATES [36], [56]–[60]”
Flexible electronics under strain: a review of mechanical characterization and durability enhancement strategies (2016, methodology): “One of the most common mechanized approaches is to affix the two ends of a substrate to plates on a translation stage [187].”
Recent progress in antireflection and self-cleaning technology – From surface engineering to functional surfaces (2014, background): “Polymer substrates have several advantages over conventional glass or silicon substrates, such as light weight, design freedom, easy processing, mechanical flexibility and low cost [242,243].”