Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

By Hua Ye, C. Basaran, D. Hopkins. 2003

236 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/2edf97905449a0c226d796fb1bfff3cd3e55c2e9

Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “also showed the existence of a thermal gradient of about 1500 C/cm in their flip chip test structures [108].”