Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails
By Eva Rajo-Iglesias, Ashraf Uz Zaman, Per-Simon Kildal. IEEE Microwave and Wireless Components Letters, 2010
198 citations recorded by the source corpus.
Subfields: Aerospace Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/2debc19cc1cf1ae745a9cc89b5fa2b013364df22
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Aerospace Engineering
- Per-Simon Kildal
- Ashraf Uz Zaman
- Eva Rajo-Iglesias
- Ahmed A. Kishk
- Esperanza Alfonso Alos
- Alejandro Valero-Nogueira
- E. Alfonso
- O. Quevedo–Teruel
In Electrical and Electronic Engineering
- Per-Simon Kildal
- Ashraf Uz Zaman
- Eva Rajo-Iglesias
- Ahmed A. Kishk
- Esperanza Alfonso Alos
- Alejandro Valero-Nogueira
- E. Alfonso
- O. Quevedo–Teruel
Citations in the corpus
- Narrow-Band Microwave Filter Using High-Q Groove Gap Waveguide Resonators With Manufacturing Flexibility and No Sidewalls (2012, methodology): “This technology can also be used for packaging of conventional microstrip circuits [11].”
- Microstrip-Ridge Gap Waveguide–Study of Losses, Bends, and Transition to WR-15 (2014, background): “The gap waveguides provide low-loss propagation for designing microwave circuits, but the technology can also be used to package normal microstrip circuits [5] and active microwave modules [6].”
- Design and experimental verification of ridge gap waveguide in bed of nails for parallel-plate mode suppression (2011, methodology): “Such a study has already been reported for some parallel-plate geometries in [4], including the pin surface.”