Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures

By Chienliu Chang, Yeong-Feng Wang, Y. Kanamori, J. Shih, Y. Kawai, Chih-Kung Lee, Kuang-Chong Wu, Masayoshi Esashi. 2005

151 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/2730a57ee2c4c4999f42a4fb62083cafdb8c5d51

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In Electrical and Electronic Engineering

1. Ming C. Wu

Citations in the corpus

• Thermal annealing in hydrogen for 3-D profile transformation on silicon-on-insulator and sidewall roughness reduction (2006, methodology): “A circular pattern with 10 m radius was first created on a 0.2– m-thick SOI wafer.”