The chemistry of additives in damascene copper plating

By P. Vereecken, R. Binstead, H. Deligianni, P. C. Andricacos. IBM Journal of Research and Development, 2005

422 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/ec10b25ba80003ad23d6c7e8d6e94178d6823ee2