High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

By I. Ndip, B. Curran, K. Lobbicke, S. Guttowski, H. Reichl, K. Lang, H. Henke. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2011

150 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/1bcb4f6c33d7a209991b62c748df898540b021ed