MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

By Cristina H. Amon, Jayathi Y. Murthy, S. Yao, S. Narumanchi, Chi-fu Wu, C. Hsieh. 2001

137 citations recorded by the source corpus.

Subfields: Computational Mechanics, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/0b716d4c94348692707225aecc9092a89358638c

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Computational Mechanics

1. Akhilesh V. Bapat
2. A. Gomez
3. Satish G. Kandlikar
4. Weiwei Deng
5. I. Mudawar
6. Gangtao Liang
7. Suresh V. Garimella
8. Yoav Peles

In Mechanical Engineering

1. Akhilesh V. Bapat
2. Satish G. Kandlikar
3. A. Gomez
4. Weiwei Deng
5. Gangtao Liang
6. I. Mudawar
7. Suresh V. Garimella
8. Yoav Peles

Citations in the corpus

• Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal (2007, methodology): “[ 40 ] discussed a MEMS-based droplet impingement embedded cooling device to remove 1 MW/m 2 (100 W/cm 2 ) from the IC chips.”
• Electrospray cooling for microelectronics (2011, background): “Contents lists available at ScienceDirect International Journal of Heat and Mass Transfer journal homepage: www.elsevier .com/locate / i jhmt Electrospray cooling for microelectronics Weiwei Deng a, Alessandro Gomez b,⇑ a Department of Mechanical, Material and Aerospace Engineering, University of Ce”