Introduction to electromagnetic compatibility

By C. Paul. 2005

1,403 citations recorded by the source corpus.

Preface. 1. Introduction to Electromagnetic Compatibility (EMC). 2. EMC Requirements for Electronic Systems. 3. Signal Spectra-The Relationship Between theTime Domain and the Frequency Domain. 4. Transmission Lines and Signal Integrity. 5. Nonideal Behavior of Components. 6. Conducted Emissions and Susceptibility. 7. Antennas. 8. Radiated Emissions and Susceptibility. 9. Crosstalk. 10. Shielding. 11. System Design for EMC. Appendix A: The Phasor Solution Method. Appendix B: The Electromagnetic Field Equations and Waves. Appendix C: Computer Codes for Calculating the Per-Unit-Length Parameters and Crosstalk of Multiconductor Transmission Lines. Appendix D: Spice (PSPICE) Tutorial. Index.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/03529a21c564c1436dc4e3030c56c7bf649e0451

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Citations in the corpus

An Embedded Common-Mode Suppression Filter for GHz Differential Signals Using Periodic Defected Ground Plane (2008, background): “It is well know that the common-mode radiation through the attached cable is proportional to the amplitude of the common-mode current on the cable [ 3 ].”
Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions (2010, methodology): “Although this model was originally developed in the early fifties [4], the first systematic approach oriented to electromagnetic compatibility (EMC) and SI applications was reported in [ 5 ] and [6], respectively.”
An improved transmission-line model of grounding system (2001, methodology): “It should be noticed that all the parameters are calculated by using the static-field analysis techniques, because the field structure for quasi-TEM mode of propagation is identical to a static (dc) field structure [ 13 ].”
Electromagnetic interference shielding mechanisms of CNT/polymer composites (2009, background): “For a sheet of homogeneous conductive material (not a composite of a conductive filler and insulative matrix), reflection is often the primary shielding mechanism [1,27,28].”
Substrate effects in monolithic RF transformers on silicon (2002, background): “By contrast, however, a patterned ground can effectively shield the electric field even when the metal thickness is much smaller than the skin depth, the main shielding mechanism here being reflection—rather than absorption loss [ 13 ].”
Low stray inductance bus bar design and construction for good EMC performance in power electronic circuits (2000, positive): “However, at low frequencies, especially in the case of bus bars, the internal inductance may become an important part of the total inductance. Its value can be calculated [ 10 ]”
Circuit Modeling of Injection Probes for Bulk Current Injection (2007, background): “Consequently, BCI-based techniques have progressively gained the attention of several international standards, spanning from the aerospace (DO EUROCAE [4]) to the commercial (IEC [ 5 ]), military (MIL-STD [6]), and automotive sectors (ISO [7] and SAE [8]).”