Low stray inductance bus bar design and construction for good EMC performance in power electronic circuits

By M. C. Caponet, Francesco Profumo, R. D. De Doncker, Alberto Tenconi. 2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018), 2000

254 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/31a7d5b7f5a63421f92158b2ecaedd286f620f94

How researchers see this paper

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In Electrical and Electronic Engineering

1. Huai Wang
2. Frede Blaabjerg
3. Xiongfei Wang
4. Marco Liserre
5. Ke Ma
6. Friedrich Wilhelm Fuchs
7. Yun Wei Li
8. Poh Chiang Loh

Citations in the corpus

• Reliability of Capacitors for DC-Link Applications in Power Electronic Converters—An Overview (2014, background): “ABD features with an abrupt burst of current leading to an immediate breakdown, while TRA exhibits a more gradual increase of leakage current.”
• Electric Drive Technology Trends, Challenges, and Opportunities for Future Electric Vehicles (2021, unknown): “The laminated busbar is widely used in high-power and integrated converters for its low parasitic inductance advantage to restrain the voltage overshoot, EMI, and switching losses [37], [38].”