The influence of time, temperature, and grain size on indentation creep in high-purity nanocrystalline and ultrafine grain copper
By Kai Zhang, J. Weertman, J. Eastman. 2004
217 citations recorded by the source corpus.
Subfields: Materials Chemistry, Mechanical Engineering, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/02cbae9acb9513eb4b019a742ee2c471c02fc21e
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In Materials Chemistry
In Mechanical Engineering
In Mechanics of Materials
Citations in the corpus
- Microscale Characterization of Mechanical Properties (2007, background): “The modulus was the same along [100] and [010], was significantly stiffer along [−110], and fell gradually with temperature for all orientations (Figure 9).”