(Journal of Micromechanics and Microengineering,12(5):611-615)A low-temperature wafer bonding technique using patternable materials

By C. Pan, H. Yang, S. Shen, M. Chou, H. Chou. 2002

158 citations recorded by the source corpus.

View Paper: https://www.semanticscholar.org/paper/028169d1dcd0a0fc4acdb8f15b1fef9c77e04141

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1. Brian J. Kim
2. Ellis Meng

Citations in the corpus

• Review of polymer MEMS micromachining (2015, background): “step [25], or even after the crosslink step [197].”