Liner materials for direct electrodeposition of Cu

By M. Lane, C. Murray, F. Mcfeely, P. Vereecken, R. Rosenberg. 2003

155 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/fe6456aa5d17e053bd6090f5ae1d9a64c9c9f78e