Nano-grained copper strip produced by accumulative roll bonding process

By Mahnoosh Shaarbaf, Mohammad Reza Toroghinejad. 2008

217 citations recorded by the source corpus.

Subfields: Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/fe0efa4a8768521f7cbbd74c1d5f8530023359ff

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Materials Chemistry

1. Manoj Gupta
2. Massoud Malaki
3. H. Dieringa

In Mechanical Engineering

1. Massoud Malaki
2. S. Ghalehbandi
3. Manoj Gupta
4. H. Dieringa

Citations in the corpus

• Accumulative Roll Bonding—A Review (2019, background): “In addition, the aforementioned behavior is also reported for Cu and its alloys [73,74], AA5052 [75], AA6014 [76], AA7075 [77], AA2024 [78] and pure Ti [79–81].”