Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder

By J. Pang, B. Xiong, T. H. Low. 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004

136 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/fd894ab3e438a606837158e35751620b71a83050