Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging

By H. Pang, K. Tan, X. Shi, Z. Wang. 2001

156 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/fd3e601a26a7ceaa16e22fd064a5568645b7ad2a