The mechanical strength of polysilicon films: Part 2. Size effects associated with elliptical and circular perforations
By I. Chasiotis, W. Knauss. 2003
154 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/f7fbb261f4365ad6ca2eb24ff783c9182d08b73b
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In Atomic and Molecular Physics, and Optics
In Biomedical Engineering
In Electrical and Electronic Engineering
Citations in the corpus
- Design and Operation of a MEMS-Based Material Testing System for Nanomechanical Characterization (2007, unknown): “It is known that surface roughness and pitting are the origins of MUMPs polysilicon fracture [29], [30].”
- Quantized fracture mechanics (2004, background): “Experiments on polysilicon thin films with holes Chasiotis and Knauss (2003) present results on micro-testing experiments for different notch radii in polysilicon thin films.”
- Failure criteria for linear elastic materials with U-notches (2006, background): “As we review only materials that show brittle— in fact, linear elastic—fracture, most of the reported data belong to ceramic materials; Alumina (Bertolotti 1973; Munz et al. 1980; Pastor 1993; Tsuji et al. 1999), silicon nitride (Ando et al. 1993; Gogotsi 2003), silicon carbide (Ando et al. 1993), s”
- Cracks, microcracks and fracture in polymer structures: Formation, detection, autonomic repair (2016, background): “The theoretical value obtained from QFM for variable micro size circular holes agreed well with experimental results from tests on polysilicon thin films [302].”