Ink‐jet Printing and Microwave Sintering of Conductive Silver Tracks
By J. Perelaer, D. Gans, Ulrich S. Schubert. 2006
591 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
View Paper: https://www.semanticscholar.org/paper/f7f176d2b750733dfbb26ec3bfa003eca3e54dc9
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Biomedical Engineering
- Kostas Kostarelos
- M. Prato
- A. Bianco
- Francesco Bonaccorso
- Leandro Lorenzelli
- A. Castellanos-Gómez
- Ravinder S. Dahiya
- William Taube Navaraj
In Electrical and Electronic Engineering
- J. Steinke
- Shlomo Magdassi
- A. Kamyshny
- Francesco Bonaccorso
- Andrea C. Ferrari
- C. Backes
- Xiaodong Zhuang
- Ravinder S. Dahiya
In Electronic, Optical and Magnetic Materials
- J. Steinke
- Shlomo Magdassi
- A. Kamyshny
- Xinliang Feng
- Andrea C. Ferrari
- Nicola Marzari
- Leandro Lorenzelli
- Jonathan N. Coleman
Citations in the corpus
- Overview of wearable electronics and smart textiles (2017, background): “ Microstructure of silver ink (Perelaer et al., 2006).”
- Metal-based Inkjet Inks for Printed Electronics (2011, background): “times of that for bulk Ag, respectively [18, 36].”
- Laser sintering of copper nanoparticles (2014, methodology): “in particular electrical sintering [22], microwave [23] and”
- Ultra-thin chips for high-performance flexible electronics (2018, background): “Silver based conductive ink and polymer based conductive material like Poly (3,4-ethylenedioxythiophene): polystyrene sulfonate (PEDOT:PSS) have been used for this purpose.(102,103) The silver ink provides much higher conductivity than PEDOT:PSS but it is susceptible to cracking during bending.”