Heterogeneous Integration of Compound Semiconductors

By O. Moutanabbir, U. Gösele. 2010

142 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/f7d80888133314644a26aa209f0c04c5abe6e922

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Atomic and Molecular Physics, and Optics

1. Mircea Guina
2. Antti Härkönen
3. A. Rantamäki

In Electrical and Electronic Engineering

1. Mircea Guina
2. G. Cross
3. Antti Härkönen
4. A. Rantamäki

Citations in the corpus

• Present and future thermal interface materials for electronic devices (2018, background): “semiconductors [23], where techniques include epitaxial growth, wafer bonding, and nanomembrane transfer.”
• Optically pumped VECSELs: review of technology and progress (2017, background): “Simply put, wafer bonding enables the integration of materials that cannot be grown monolithically without introducing an excessive number of defects due to mismatched lattice constants and coefficients of thermal expansion [142].”