Toughening Epoxy Adhesives to Meet Today’s Challenges
By A. Kinloch. 2003
197 citations recorded by the source corpus.
There are many advantages that polymeric adhesives can offer compared with the more traditional methods of structural joining such as bolting, brazing, welding, and mechanical fastening, and epoxy adhesives represent the most common type of structural adhesive. When polymerized, epoxy adhesives are amorphous and highly cross-linked materials, and this microstructure results in many useful properties for structural engineering applications, such as a high modulus and failure strength, low creep, and, by careful formulation, good performance at elevated temperatures. However, the structure of such thermosetting adhesives also generally leads to one highly undesirable property: they are relatively brittle materials, with poor resistance to crack initiation and growth. Nevertheless, the incorporation of a second phase of dispersed rubbery particles into the epoxy polymer can greatly increase their toughness without significantly impairing their other desirable engineering properties. Thus, rubber-toughened epoxy adhesives can be used, for example, in applications where very high impact resistance is required for the bonded joint.
Subfields: Mechanical Engineering, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/f5811e9648e6136fed083c821133a8689be28af4
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In Mechanical Engineering
In Mechanics of Materials
Citations in the corpus
- A novel phosphorus-containing semi-aromatic polyester toward flame retardancy and enhanced mechanical properties of epoxy resin (2020, unknown): “In this work, a novel phosphorus-containing semi-aromatic polye-ster named poly[4,4 ′ -bis(6-hydroxyhexyloxy)biphenyl 9,10-dihydro- 10-[2,3-di(hydroxycarbonyl)propyl]-phosphaphenanthrene-10-oxide] (PBHDDP) was designed and synthesized, then utilized as a single-component additive combining…”
- Coupled multi‐scale cohesive modeling of failure in heterogeneous adhesives (2010, background): “The focus of the present work is on the multi-scale modeling of heterogeneous thin layers, such as rubber-toughened adhesives [4], silver-enriched epoxy adhesives [5], and selfhealing adhesives [6].”