Selection of optimum conditions for maximum material removal rate with surface finish and damage as constraints in SiC grinding

By A. V. Gopal, P. Venkateswara Rao. 2003

138 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/f3e22124e0828634ab86ab63022e16993216f913

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. A. Tiwari
2. M. Muralidhar
3. R. Singh
4. Chimata Murali Krishna
5. Anuj Kumar Sharma
6. Amit Rai Dixit
7. A. Pramanik
8. M. Chandrasekaran

In Electrical and Electronic Engineering

1. A. Tiwari
2. M. Muralidhar
3. R. Singh
4. Chimata Murali Krishna
5. Anuj Kumar Sharma
6. Amit Rai Dixit
7. A. Pramanik
8. M. Chandrasekaran

In Mechanical Engineering

1. Amit Rai Dixit
2. Anuj Kumar Sharma
3. A. Tiwari
4. M. Muralidhar
5. R. Singh
6. Chimata Murali Krishna
7. A. Pramanik
8. M. Chandrasekaran

Citations in the corpus

• Performance Evaluation of Alumina-graphene Hybrid Nano-cutting Fluid in Hard Turning (2017, methodology): “Usually, a second order model is utilized in RSM (Gopal and Rao, 2003).”
• Application of soft computing techniques in machining performance prediction and optimization: a literature review (2010, methodology): “Gopal and Rao [115] developed a GA-based optimization procedure to optimize grinding conditions, viz.”