Heterogeneously integrated III–V/Si MOS capacitor Mach–Zehnder modulator
By T. Hiraki, T. Aihara, K. Hasebe, K. Takeda, T. Fujii, T. Kakitsuka, T. Tsuchizawa, H. Fukuda, Shinji Matsuo. Nature Photonics, 2017
152 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/f34362103d2bfe4b00a5aa7c5c10fcaddea63c13
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Citations in the corpus
- Review of Silicon Photonics Technology and Platform Development (2021, background): “Some approaches use vertical junctions, such as SISCAP (silicon-insulator-silicon capacitors) junctions, with the idea of increasing the junction depletion region that overlaps with the optical mode, albeit at the cost of higher fabrication complexity.”
- Graphene-based integrated photonics for next-generation datacom and telecom (2018, methodology): “3b, we compare the FOM of graphene modulators with those of p–n junction Si modulators, Si–insulator–Si modulators[104] (black curve) and InGaAsP membranes on Si (refs[105,106]).”
- Taking silicon photonics modulators to a higher performance level: state-of-the-art and a review of new technologies (2021, background): “But, the electro-optic cut-off frequency is rather limited due to the large oxide capacitance in the carrier accumulation mode of operation.(161,163) One possible approach to break the trade-off between the high-speed operation and high modulation efficiency banks on operating the III–V on Si MOS ph”