Chip cooling with integrated carbon nanotube microfin architectures

By K. Kordas, G. Tóth, P. Moilanen, M. Kumpumäki, J. Vähäkangas, A. Uusimäki, R. Vajtai, Pulickel M. Ajayan. 2007

264 citations recorded by the source corpus.

Efficient cooling of silicon chips using microfin structures made of aligned multiwalled carbon nanotube arrays is achieved. The tiny cooling elements mounted on the back side of the chips enable power dissipation from the heated chips on the level of modern electronics demands. The nanotube fins are mechanically superior compared to other materials being ten times lighter, flexible, and stiff at the same time. These properties accompanied with the relative simplicity of the fabrication makes the nanotube structures strong candidates for future on-chip thermal management applications.

Subfields: Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/f04fbf3f625b11a16a0bf1ad575880af5358512b

Citations in the corpus

• A Review of Cooling in Microchannels (2011, unknown): “Another way of pattern generation is processing the uniformly grown CNT layers by laser ablation [5, 77] or solvent treatment [78, 79].”