Thermal analysis of polymers : fundamentals and applications

By J. Menczel, R. Prime. 2009

523 citations recorded by the source corpus.

Chapter I: Introduction (Joseph D. Menczel, R. Bruce Prime and Patrick K. Gallagher). Chapter II: Differential Scanning Calorimetry (Joseph D. Menczel, Lawrence H. Judovits, R. Bruce Prime, Harvey E. Bair, Mike Reading, and Steven Swier). 1. Introduction. 2. Elements of Thermodynamics in DSC. 3. The Basics of Differential Scanning Calorimetry. 4. Purity Determination of Low Molecular Mass Compounds by DSC. 5. Calibration of Differential Scanning Calorimeters. 6. The Measurement of Heat Capacity. 7. Phase Transitions in Amorphous and Crystalline Polymers. 8. DSC of Fibers. 9. Films. 10. Thermosets. 11. Differential Photocalorimetry (DPC). 12. Fast Scan DSC. 13. Modulated Temperature Differential Scanning Calorimetry (MTDSC). 14. How to Perform DSC Measurements . 15. Instrumentation. References. Chapter III: Thermogravimetric Analysis (TGA) (R. Bruce Prime, Harvey E. Bair, Sergey Vyazovkin, Patrick K. Gallagher, and Alan Riga). 1. Introduction. 2. Background Principles and Measurement Modes. 3. Calibration and Reference Materials. 4. Measurements and Analyses. 5. Kinetics. 6. Selected Applications. 7. Instrumentation. Appendix. References. Chapter IV: Thermomechanical Analysis (TMA) and Thermodilitometry (TD) (Harvey E. Bair, Ali E. Akinay, Joseph D. Menczel, R. Bruce Prime, and Michael Jaffe). 1. Introduction. 2. Principles and Theory. 3. Instrumental. 4. Calibration. 5. How to Perform a TMA Experiment. 6. Key Applications. 7. Selected Industrial Applications. Appendix. References. Chapter V: Dynamic Mechanical Analysis (DMA) (Richard P. Chartoff, Joseph D. Menczel, and Steven H. Dillman). 1. Introduction. 2. Characterization of viscoelastic behavior. 3. Applications of dynamic mechanical analysis. 4. Examples of DMA characterization for thermoplastics. 5. Characteristics of fibers and thin films. 6. DMA characterization of cross-linked polymers. 7. Practical Aspects of Conducting DMA Experiments. 8. Commercial DMA Instrumentation. Appendix. References. Chapter VI: Dielectric Analysis (DEA) (Aglaia Vassilikou-Dova and Ioannis M. Kalogeras). 1. Introduction. 2. Theory and background of dielectric analysis. 3. Dielectric techniques. 4. Performing dielectric experiments. 5. Typical measurements on poly(methyl methacrylate) (PMMA). 6. Dielectric Analysis of Thermoplastics. 7. Dielectric Analysis of Thermosets. 8. Instrumentation. Appendix. References. Chapter VII: Micro and Nano Scale Local Thermal Analysis (Valeriy V. Gorbunov, David Grandy, Mike Reading, and Vladimir V. Tsukruk). 1. Introduction. 2. The Atomic Force Microscope. 3. Scanning Thermal Microscopy. 4. Thermal Probe Design and Spatial Resolution. 5. Measuring Thermal Conductivity and Thermal Force-Distance Curves. 6. Local Thermal Analysis. 7. Performing a Micro/Nano Thermal Analysis Experiment. 8. Examples of Micro/Nano Thermal Analysis Applications. 9. Overview of Local Thermal Analysis. References.

Subfields: Materials Chemistry, Polymers and Plastics

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Citations in the corpus

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Cure kinetics characterization and monitoring of an epoxy resin using DSC, Raman spectroscopy, and DEA (2013, background): “Acceptable cure temperatures can also be proposed to avoid premature vitrification and high temperatures at which undesirable side reactions or degradation may occur [5].”