Laser-based powder bed fusion additive manufacturing of pure copper
By S. Jadhav, L. Goossens, Yannis Kinds, B. Hooreweder, K. Vanmeensel. Additive Manufacturing, 2021
206 citations recorded by the source corpus.
Abstract In this article, the laser-based powder bed fusion (L-PBF) processing behavior of pure copper powder is evaluated by employing a conventional infrared fiber laser with a wavelength of 1080 nm, a small focal spot diameter of 37.5 µm, and power levels up to 500 W. It is shown that bulk solid copper parts with near full density (ρ Archimedes = 99.3 ± 0.2%, ρ Optical = 99.8 ± 0.1%) can be produced using a laser power of 500 W for the chosen combination of powder particle size, L-PBF settings, and pure copper baseplate. Moreover, at 500 W, parts with a relative density exceeding 99% are manufactured within a volumetric energy density window of 230 - 310 J/mm3, while laser power levels below 500 W did not produce parts with a relative density above 99%. An analytical model is used to elucidate the L-PBF processing behavior, wherein both conduction and keyhole regimes corresponding to the employed L-PBF settings are identified. The analytical model-based results predict that the bulk solid copper parts with near full density are produced in a keyhole regime prior to the onset of keyhole-induced porosity, which is in accordance with the porosity types observed in the parts. The L-PBF fabricated copper parts exhibit an electrical conductivity of 94 ± 1% compared to the international annealed copper standard (IACS) and demonstrate a tensile strength of 211 ± 4 MPa, a yield strength of 122 ± 1 MPa, and an elongation at break of 43 ± 3% in the as-built condition.
Subfields: Automotive Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/ef6d4888a021db6c8a88d67607bec1bad34924ef
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Citations in the corpus
- Review of Powder Bed Fusion Additive Manufacturing for Metals (2021, methodology): “The as-built pure copper parts using laser melting exhibited a tensile strength of 211 ± 4 MPa, a yield strength of 122 ± 1 MPa, an elongation at failure of 43 ± 3%, and an electrical conductivity of 94 ± 1% IACS [322].”