Morphology and Bond Strength of Copper Wafer Bonding

By Kuan-Neng Chen, C. S. Tan, A. Fan, R. Reif. 2004

165 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/ede1851d3f7f1d7d2376b477deccd181a011d4ed