Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials

By Mukul Kumar, A. Schwartz, Wayne E. King. 2002

249 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/ed6efa68820175d85d32a6556f664ff8744699d5

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Citations in the corpus

• Alloys for Aeronautic Applications: State of the Art and Perspectives (2019, background): “Today, grain boundary engineering (GBE) represents an interesting field of research that could contribute to the reduction of inter-crystalline damage to superalloys and, in general, to the improvement of their mechanical properties [156].”
• Annealing twin development during recrystallization and grain growth in pure nickel (2014, unknown): “2 There are four schools of thought on annealing twin formation: i) the grain encounter model [7-9], ii) the stacking fault model [10] where stacking fault packets formed during grain boundary migration generate annealing twins [11], iii) the grain boundary dissociation model [11-13] which involves ”